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Semi-Auto Expander "SE-200"

To prevent interference during chip pickup! The expansion amount can be repeatedly performed under pre-set conditions.

The "SE-200" is a semi-auto expander that can move an IC substrate, which has been diced into individual pieces, to an expansion ring while maintaining a gap to prevent interference between the chips before picking them up. The expansion conditions for the IC substrate can be set, and the reproducibility makes it suitable for mass production. The preheating position, time, expansion amount, and speed of the IC substrate can be repeatedly reproduced, ensuring stable quality. 【Features】 ■ The preheating position, time, expansion amount, and speed of the IC substrate can be set and adjusted via a monitor. ■ The expansion amount can be repeatedly performed under pre-set conditions. ■ Design modifications can be made to match the tape frame and expansion ring used (optional). ■ A jig for accurately fitting the outer ring of the expansion ring is available (optional). *For detailed information and product catalog requests, please access the related link.

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